PyroArk®TG Series Thermal Interface Material - MINORU Co., Ltd.

ミノル株式会社
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AH Series
RF Absorber
AHG Series
RF Absorber
RFID&NFC series
RF Absorber
HCST Series
Heat Spreader
TG Series
Thermal Interface
EMI Shield

 TG Series Termal Interface
PyroArk®The TG series thermal interface material is a heat dissipation sheet that utilizes the flexibility, temperature durability and electrical insulation properties of silicone.  

It is highly flexible, and it can efficiently transfer heat by filling the gap.  Also, due to its high flexibility, it is possible to contact multiple heat sources with varying heights at once.

The TG series has a wide operating temperature range of -50 degrees to +200 degrees and has flame resistance equivalent to UL94 V-0 and can be used for a wide range of applications.   The thickness is 0.5 mm increments and can be laminated to accommodate various thicknesses.
TG Series Thermal Interface Material
TG Series Thermal Interface Material
TG Series Thermal Interface Material
TG Series Overview
Structure
MINORU® TG series Thermal Interface Material is a heat dissipation sheet that makes the most of silicone's flexibility, temperature durability and electrical insulation performance.
Structure
TG Series TIM Structure
Characteristic
*Highly compliant TIM filled with high thermal conductivity filler by taking advantage of silicone flexibility
*Stable in a wide temperature range, so can be used in harsh environments such as in-vehicle
* Can be used as a shock absorbing compliance connecting material such as shock and vibration absorption
Application
∗ Gap fill at the joint between heat source and heat sink
Specification
TG Series TIM P/N
Environment

TG Series General Characteristics (typical)
アイテム
Item
TG15
TG20
TG30
TG40
TG50
TG100
TG120
単位
Unit
測定方法
Method
熱伝導率
Thermal Conductivity
1.5
2.2
3
4
5
10
12
w/mk
ASTM D5470
色調
Color
灰色
Gray


硬度
Hardness
20-30
20-30
30-40
35-50
40-60
40-60
40-60

Shore C
比重
Density @ 25°C
2.7
2.7
2.9
3.1
3.3
5.1
5.6
g/cm3

体積抵抗
Volume Resistivity
1*1013
Ω・cm
ASTM D257-14
絶縁破壊強度
Dielectric Strength
8.8
8.8
8.8
8.8
≥8
≥11
≥11
kV/mm
ASTM D149-09
誘電率
Dielectric Constant  
4.9
4.7
4.8
4.5
6.08
6.91
6.93
@1MHz
ASTM D150-11
引張強度
Tensile Strength
42
48
45
55
50
50
50
psi
ASTM D412
Elongation
82
%
ASTM D412
Thermal Expansivity
63
63
63
58
48
43
41
ppm/℃
IPC-TM-6502.4.24
Outgassing (TML)
0.1
0.1
0.11
0.11
0.006
0.006
0.006
%
ASMT E595-07
Outgassing (CVCM)
0.025
0.025
0.025
0.026
0.025
0.025
0.025
%
ASMT E595-070
難燃性
Flammability
V0

UL94(Equivalent)
使用温度範囲
Operating Temperature
-50 to 200
TG Series Product List
Series
P/N
Thermal Condactivity  (W/m・K)
Thickness (um)
Std. Size (mm)    
TG15
TG15-050
1.5
500
200mm*400mm
TG15-100
1000
TG15-150
1500
TG15-200
2000
TG20
TG20-050
2.2
500
TG20-100
1000
TG20-150
1500
TG20-200
2000
TG30
TG30-050
3
500
TG30-100
1000
TG30-150
1500
TG30-200
2000
TG40
TG40-050
4
500
TG40-100
1000
TG40-150
1500
TG40-200
2000
TG50
TG50-050
5
500
TG50-100
1000
TG50-150
1500
TG50-200
2000
Series
P/N
Thermal Condactivity  (W/m・K)
Thickness (um)
Std. Size (mm)
TG100
TG100-050

10
500
200mm*400mm
TG100-100
1000
TG100-150
1500
TG100-200
2000
TG120
TG120-050
15
500
TG120-100
1000
TG120-150
1500
TG120-200
2000
TG50 Thermal impedance, defection Vs force data
Deflection (%) vs. PSI
Compression (Psi) vs. thermal conductivity
TG Series applilcation example

By utilizing its thickness and flexibility, TG series enables connection to multiple target devices.

By combining with a heat spreader sheet HCST.CST, it is possible to radiate heat effectively from the Z direction to the X-Y direction.
Typical usage example
Storage period

The storage period is one years from the product production date.
The storage conditions are room temperature (22°C, humidity 50% RH)
packaged in the original package.
This product is designed for consumer equipment.
 

All items and values described here are measured values by our company and are not guaranteed values.
In addition, we do not guarantee the quality after incorporating your device.
Before using the product, be sure to thoroughly study the purpose and conditions of use,
and be sure to conduct a test at your company for confirmation.
In addition, we do not guarantee industrial property rights such as patents regarding usage and purpose.
All numerical values and data presented in this site are example and not warranted at anyway.
Product drawing and specification sheet always represent the latest product information.
Specification and drawing within this site are just for illustrated purpose, not intended as a product specification whatever.
Information presented herein this site may change without prior notification at anytime.
All rights reserved.
Minoru Co., Ltd.
5-21-13 Pegasus Stataion Plaza Kamata B2F-2
Kamata, Ota-ku, Tokyo 144-0052 JAPAN

Minoru Co., Ltd. develop and manufacture high performance RF absorber, thermal interface materials, adhesive, and PI tape for automotive, medical, and mobile handheld devices.

Copyright(c) 2020 MINORU Co., Ltd. All rights reserved.
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