EleFlux®CUBS Series EMI Shield Heat Spreader

AH Series

RF Absorber

AHG Series

RF Absorber

RFID&NFC series

RF Absorber

HCST Series

Heat Spreader

TG Series

Thermal Interface

EMI Shield

CUBS Series EMI Shield Hear Spreader

Minoru EleFlux® CUBS series is a heat radiation EMI shield sheet based on Cu foil and newly developed graphene. With Cu substrate, CUBS have high EMI shielding properties for a wide range of frequencies and high thermal conductivity.

CUBS Series Overview

Overview	MINORU® EleFlux® Heat dissipation shield Single-sided copper foil tape CUBS series is a thin product with high EMI shielding properties and heat dissipation properties. CUBS has stable shield characteristics in a wide range from 30MHz to 3GHz.
Structure
Characteristic	* It has high processability such as die cutting. High heat dissipation characteristics in the XY directions. The magnetic shield layer can be used as a magnetic field and electrolytic shield + heat dissipation. *Unlike graphite etc., the generation of foreign matter during die cutting is minimal.
Application	∗ Electromagnetic wave shield and heat dissipation of ECU etc. ∗ EMI shield for various electronic devices *LCDM EMI and light shield, driver IC heat dissipation
Specification
Environment	CUBS series are halogen-free products.

CUBS Series General Characteristics (typical)

Product	CU02BS	CU03BS	CU06BS	CU08BS	CU10BS
Color	Black
Infrared radiation layer (um)	4±10%	4±10%	7±10%	7±10%	7±10%
Thermal diffusion Cu layer (um)	7±10%	10±10%	20±10%	30±10%	50±10%
Thermally conductive adhesive layer (um)	10±10%	11±10%	20±10%	30±10%	30±10%
Total Thickness (um)	20um – 25um	30±10%	60±10%	80±10%	100±10%
Operating Temperature (℃)	-40 to 100
Frame retardance	UL94V0
Standard Size	500mm*50m

CUBS Series performance characteristics (Typical)

Product	CU02BS	CU03BS	CU06BS	CU08BS	CU10BS	Method
Surface resistance (Adhesive) ( Ω/□)	≤0.03	≤0.01				MIL 83528
Infrared emissivity	1.1					ASTM C1371
Horizontal thermal conductivity (W/m.k)	800	801	837	891	903	ASTM D5470
Vertical thermal conductivity (W/m.k)	3.79	4.21	5.17	6.78	7.07	ASTM D149
Adhesive strength (N/25mm,180°)	≥7.5	≥8	≥10	≥11	≥13	PSTC-1
Adhesive holing power (hours/25mm)	>48					PSTC-7
Volume resistivity (Ω/cm)	1*10¹³					ASTM D257
Density g/cm³	2.1	2.9	3.2	4	5.3
Electrical conductivity (S/M)	5.1*10E+8	5.9*10E+8	7.7*10E+7	8.1*10E+7	9.5*10E+7
Tensile Strength	＞30N/10mm
Thermal Capacity (50°C J/g.k)	445	425	408	405	397
Weatherbility　1500Hrs	OK
Bending characteristics (180° R5 U shape)	150,000
Shield performance	＞90dB@(30 MHz to 3 GHz)					MIL-STD-285

CUBS Series EMI Shield Characteristics

Storage period

The storage period is one year from the product production date.

The storage conditions are room temperature (22°C, humidity 50% RH)

packaged in the original package.

This product is designed for consumer equipment.

All items and values described here are measured values by our company and are not guaranteed values.

In addition, we do not guarantee the quality after incorporating your device.

Before using the product, be sure to thoroughly study the purpose and conditions of use,

and be sure to conduct a test at your company for confirmation.

In addition, we do not guarantee industrial property rights such as patents regarding usage and purpose.

All numerical values and data presented in this site are example and not warranted at anyway.

Product drawing and specification sheet always represent the latest product information.

Specification and drawing within this site are just for illustrated purpose, not intended as a product specification whatever.

Information presented herein this site may change without prior notification at anytime.