CUBS Series EMI Shield Heat Spreader - MINORU Co., Ltd.

ミノル株式会社
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AH Series
RF Absorber
AHG Series
RF Absorber
RFID&NFC series
RF Absorber
HCST Series
Heat Spreader
TG Series
Thermal Interface
EMI Shield

 CUBS Series EMI Shield Hear Spreader
Minoru CUBS series is a heat radiation EMI shield sheet based on Cu foil and newly developed graphene. With Cu substrate, CUBS have high EMI shielding properties for a wide range of frequencies and high thermal conductivity. Also, a special magnetic shield layer enables suppression of magnetic field noise. It has high workability and has high shielding characteristics against heat radiation, electrolytic and magnetic field noise.
CUBS Series Overview
Overview
MINORU® Heat dissipation shield Single-sided copper foil tape CUBS series is a thin product with high EMI shielding properties and heat dissipation properties. CUBS has stable shield characteristics in a wide range from 30MHz to 3GHz. A special magnetic shield layer enables a stronger shield.
Structure
CUBS EMI Shield Heat Spreader Structure
Characteristic
* It has high processability such as die cutting.
*High heat dissipation characteristics in the XY directions.
*The magnetic shield layer can be used as a magnetic field and electrolytic shield + heat dissipation.
*Unlike graphite etc., the generation of foreign matter during die cutting is minimal.
Application
∗ Electromagnetic wave shield and heat dissipation of ECU etc.
∗ EMI shield for various electronic devices
*LCDM EMI and light shield, driver IC heat dissipation
Specification
CUBS EMI Shield Heat Spreader P/N
Environment
CUBS series are halogen-free products.
CUBS Series General Characteristics (typical)
   Product
CU02BS
CU03BS
CU06BS
CU08BS
CU10BS
Color
Black
Infrared radiation layer (um)
4±10%
4±10%
7±10%
7±10%
7±10%
Magnetic Shield layer (um)
2±10%
5±10%
13±10%
13±10%
13±10%
Thermal diffusion Cu layer (um)
7±10%
10±10%
20±10%
30±10%  
50±10%
Thermally conductive adhesive layer (um)
10±10%
11±10%
20±10%
30±10%
30±10%
Total Thickness (um)
20um – 25um
30±10%
60±10%
80±10%
100±10%
Operating Temperature (℃)
-40 to 100
Frame retardance
UL94V0
Standard Size
500mm*50m
CUBS Series performance characteristics (Typical)
Product
CU02BS
CU03BS
CU06BS
CU08BS
CU10BS
Method
Surface resistance
(Adhesive) ( Ω/□)
≤0.03
≤0.01
MIL 83528
Infrared emissivity
1.1
ASTM C1371
Horizontal thermal conductivity  (W/m.k)  
800
801
837
891
903
ASTM D5470
Vertical thermal conductivity (W/m.k)
3.79
4.21
5.17
6.78
7.07
ASTM D149
Adhesive strength (N/25mm,180°)
≥7.5
≥8
≥10
≥11
≥13
PSTC-1
Adhesive holing power (hours/25mm)
>48
PSTC-7
Volume resistivity (Ω/cm)  
1*1013
ASTM D257
Density  g/cm³
2.1    
2.9
3.2
4
5.3

Electrical conductivity (S/M)
5.1*10E+8
5.9*10E+8
7.7*10E+7
8.1*10E+7
9.5*10E+7

 Tensile Strength
>30N/10mm

Thermal Capacity (50°C  J/g.k)
445
425
408
405
397

Weatherbility 1500Hrs
OK

Bending characteristics
(180° R5 U shape)
150,000

Shield performance
>90dB@(30 MHz to 3 GHz)
MIL-STD-285
CUBS Series EMI Shield Characteristics
CUBS EMI Shield Characteristics
Storage period

The storage period is one year from the product production date.
The storage conditions are room temperature (22°C, humidity 50% RH)
packaged in the original package.
This product is designed for consumer equipment.
 

All items and values described here are measured values by our company and are not guaranteed values.
In addition, we do not guarantee the quality after incorporating your device.
Before using the product, be sure to thoroughly study the purpose and conditions of use,
and be sure to conduct a test at your company for confirmation.
In addition, we do not guarantee industrial property rights such as patents regarding usage and purpose.
All numerical values and data presented in this site are example and not warranted at anyway.
Product drawing and specification sheet always represent the latest product information.
Specification and drawing within this site are just for illustrated purpose, not intended as a product specification whatever.
Information presented herein this site may change without prior notification at anytime.
All rights reserved.
Minoru Co., Ltd.
5-21-13 Pegasus Stataion Plaza Kamata B2F-2
Kamata, Ota-ku, Tokyo 144-0052 JAPAN

Minoru Co., Ltd. develop and manufacture high performance RF absorber, thermal interface materials, adhesive, and PI tape for automotive, medical, and mobile handheld devices.

Copyright(c) 2020 MINORU Co., Ltd. All rights reserved.
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