PyroArk®CST Series EMI Shield Thermal Spreader

AH Series

RF Absorber

AHG Series

RF Absorber

RFID&NFC series

RF Absorber

HCST Series

Heat Spreader

TG Series

Thermal Interface

EMI Shield

CST Series Heat Spreader

Minoru PyroArk® CST series heat spreader / dissipation EMI shield is a low-cost thermal conduction sheet based on copper foil and newly developed high performance graphene heat conduction layer.

It is possible to make a stable connection to the adherend via the heat conductive adhesive layer. There are wide variety of thicknesses, which enhances the design flexibility when used in combination with other components.

Based on copper foil, it has high EMI shielding characteristics for wide frequency range.

CST Series Overview

Overview	MINORU® Heat Spreader shield Single-sided copper foil tape CST series is a low-profile product with high EMI shielding properties and heat spreading characteristics. CST has stable shield characteristics in a wide range from 30MHz to 3GHz.
Structure
Characteristic	* Has high processability such as die cutting. High heat dissipation characteristics in the XY directions. As it is a very thin copper foil base, it has high conformability to bent parts. * Flexible and can be attached to curved areas
Application	∗ Electromagnetic wave shield and heat dissipation of ECU etc. ∗ EMI shield for various electronic devices *LCDM EMI and light shield, driver IC heat dissipation
Specification
Environment	CST series are halogen-free products.

CST Heat Spreader with Graphene

CST Series General Characteristics (typical)

Product	CST02	CST03	CST05	CST08	CST10
Cu Foil Type	electrolytic	rolling
Black heat dissipation layer (um)	4±10%	4±10%	7±10%	10±10%	10±10%
Cu thickness (um)	6±10%	11±10%	20±10%	40±10%	50±10%
Thermal conductive adhesive (um)	10±10%	15±10%	23±10%	30±10%	40±10%
Total Thickness(um)	20 (20 to 25)	30±5	50±5	80±10%	100±10%
Color	Matt Black
Operating Temperature (℃)	-40 to 125
Liner	PET

CST Series Performance Characteristics (typical)

Product	CST02	CST03	CST05	CST08	CST10	Method
热辐射 Infrared Emissivity	1.1					ASTM C1371
水平方向熱伝導率 X-Y direction Thermal Conductivity (W/m.k)	811	827	871	891	917	ASTM D5470
垂直方向熱伝導率 Z direction Thermal Conductivity (W/m.k)	4	5	6	7	7	ASTM D5470
粘着力 Adhesion (N/25mm,180°)	8	12	≥12			PSTC-1
粘着保持力 Retention (hours/25mm) @室温	>48					PSTC-7
体積低効率 Volume Resistance(Ω.cm)	10¹³					ASTM D257
密度 Density g/cm³	2.9	3.2	4.1	5.3	5.9
Electrical conductivity（S/M)	5.9*10⁸	7.7*107	8.1*107	9.5*107	9.5*107
引張强度 Tensile strength	＞30N/10mm
熱容量 Heat capacity （50°C J/g.k)	425	408	405	397	361
耐候性 Weather ability evaluation 1500Hrs	OK
シールド特性 Shielding Effectiveness	＞90dB@(30 MHz to 3 GHz)					MIL-STD-285
屈曲特性　Bending （180° R5 U型）	≥15
難燃性 Flame retardant	V0					UL94

CST Series EMI Shield Characteristics

CST EMI Shield Characteristics

Storage period

The storage period is one years from the product production date.

The storage conditions are room temperature (22°C, humidity 50% RH)

packaged in the original package.

This product is designed for consumer equipment.

All items and values described here are measured values by our company and are not guaranteed values.

In addition, we do not guarantee the quality after incorporating your device.

Before using the product, be sure to thoroughly study the purpose and conditions of use,

and be sure to conduct a test at your company for confirmation.

In addition, we do not guarantee industrial property rights such as patents regarding usage and purpose.

All numerical values and data presented in this site are example and not warranted at anyway.

Product drawing and specification sheet always represent the latest product information.

Specification and drawing within this site are just for illustrated purpose, not intended as a product specification whatever.

Information presented herein this site may change without prior notification at anytime.