PyroArk®81015 Thermal Conductive Tape - MINORU Co., Ltd.

ミノル株式会社
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AH Series
RF Absorber
AHG Series
RF Absorber
RFID&NFC series
RF Absorber
HCST Series
Heat Spreader
TG Series
Thermal Interface
EMI Shield

 81015 PI Thermal Tape
Minoru PyroArk® Heat Dissipation Tape 81015 is based PI substrate specially formulated for high reliabiity automotive electronics and high heat conductivity application for MINI LED & other high performance display.
81015 on Heat shink
81015 Overview
Overview
MINORU® PyroArk® 81015 series is thermal condcutive tape with PI film substrate that offers high thermal conductivity of (1.1W/mk).
Structure
81015 layer
Characteristic
*Rework possible
*High thermal conductivity
*Sufficient bonding strength for adherends such as heat sinks
Application
*LED/MINI LED light bar installation and heat dissipation measures
∗ Joining of heat source and heat sink
∗ Graphite and other heat equalizing sheet and target Z-Axis heat dissipation joint
∗ Attached metal foil EMI shield, as a heat radiation EMI shield composite product
Specification
81015 p/n
Environment
81015 is a  halogen-free product.
81015 General Characteristics (typical)
Product
81015
Method
Item
Value
Thermal Conductivity (W/m.k)
1.1
ASTM D5470
Color
Pale yellow

Thickness(um)
150±20%

Voltage Resistance Value (KV/mm)
7.3
ASTM D149
Specific Gravity g/cm³
1.79

Adhesive Strength (N/25mm,180°)
18
PSTC-1
Retention (hours/25mm
>48
PSTC-7
Volume Resistivity (Ω.cm)
1014
ASTM D257
Thermal Resistance (℃∙in2/W,50 psi)
0.3
ASTM D5470
Operating Working Temperature (°C)
-45 to 150

RoHS, Halogen Free
Pass
SGS
81015 180° peel strength
Material
81015
Aluminum alloy
17
ABS resin
19
Acrylic resin
19
Polystyrene resin
19
Hard PVC resin
19
Polycarbonate resin
21
Polyethylene
6
Polypropylene
6
Glass
18
Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes.

Test Parameters
Assembly Procedure-Pressed
Force
2Kg
Time
30sec
Test Conditions
Dwell time
30min at RT
Test Speed
300 mm/min
Temperature
23±1 ̊C
Relative Humidity
50±5%
81015 Adhesion  after aging 180° peel
Test  conditions
Aging time
Data  N/in
65°C 90%RH
1500Hr
36
-40°C&60%RH
1500Hr
32
90°C  &60% RH
1500Hr
29
-40°C(0.5H)~85°C(0.5H)
1200 cycle
28
81015 Thermal  conductivity  after aging
Test  conditions
Aging time
Data  w/mk
65°C 90%RH
1500Hr
1.3
-40°C&60%RH
1500Hr
1.1
90°C  &60% RH
1500Hr
1.1
-40°C(0.5H)~85°C(0.5H)
1200 cycle
1.1
81015 Dynamic Shear
Test  conditions
Aging time
Data  N/cm²
65°C 90%RH
1500Hr
560
-40°C&60%RH
1500Hr
610
90°C  &60% RH
1500Hr
579
-40°C(0.5H)~85°C(0.5H)
1200 cycle
591
Dynamic Shear Set Up
Storage period

The storage period is one years from the product production date.
The storage conditions are room temperature (22°C, humidity 50% RH)
packaged in the original package.
This product is designed for consumer equipment.
 

All items and values described here are measured values by our company and are not guaranteed values.
In addition, we do not guarantee the quality after incorporating your device.
Before using the product, be sure to thoroughly study the purpose and conditions of use,
and be sure to conduct a test at your company for confirmation.
In addition, we do not guarantee industrial property rights such as patents regarding usage and purpose.
All numerical values and data presented in this site are example and not warranted at anyway.
Product drawing and specification sheet always represent the latest product information.
Specification and drawing within this site are just for illustrated purpose, not intended as a product specification whatever.
Information presented herein this site may change without prior notification at anytime.
All rights reserved.
Minoru Co., Ltd.
5-21-13 Pegasus Stataion Plaza Kamata B2F-2
Kamata, Ota-ku, Tokyo 144-0052 JAPAN

Minoru Co., Ltd. develop and manufacture high performance RF absorber, thermal interface materials, adhesive, and PI tape for automotive, medical, and mobile handheld devices.

Copyright(c) 2020 MINORU Co., Ltd. All rights reserved.
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